SKU:231401329C
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Brand new and high quality
Solder tin paste is the best choice of reballing IC
It is used instead of the pin in the IC component package structure
Specification:
Brand: BEST
Model: 505
Material: tin
Diameter: 0.2mm~0.65mm
Flux content: 63%
Melting point: 183°C
Working temperature: 200-380°C
Quantity: 25,000pcs per bottle
Balls alloy: Sn63/Pb37
Size: 35x16mm
Package included:
1 x 1 Bottle Tin BGA Reballing Soldering Balls
Brand new and high quality
Solder tin paste is the best choice of reballing IC
It is used instead of the pin in the IC component package structure
Specification:
Brand: BEST
Model: 505
Material: tin
Diameter: 0.2mm~0.65mm
Flux content: 63%
Melting point: 183°C
Working temperature: 200-380°C
Quantity: 25,000pcs per bottle
Balls alloy: Sn63/Pb37
Size: 35x16mm
Package included:
1 x 1 Bottle Tin BGA Reballing Soldering Balls
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