MIJING K30 Mobile Phone Mainboard Special Fixture for Planting Tin for iPhone 11 Pro 5.8 inch/11 Pro Max 6.5 inch

MJ 2 in 1 BGA Reballing Stencil Platform Jig Fixure is professional BGA Reballing Stencil Fixture for iPhone 11, motherboard BGA reballing fixture tool, is used for positioning and reballing PCB BGA parts, convenient and faster for reballing BGA without any damage, offer you best solution for iPhone 11 BGA reballing and repairing.

• Install the cell phone main board on the platform

• Cover the cell phone BGA reballing stencil on mainboard

• Evenly spread tin on the cover of the reballing stencil

• Remove the reballing stencil cover

• Take out the motherboard and cooperate with the hot air gun to solidify the tin point

Compatible with:

• iPhone 11 Pro 5.8 inch

• iPhone 11 Pro Max 6.5 inch

Package included:

• 1 x MiJing K30 Mobile Phone Mainboard Special Fixture for Planting Tin for Phone 11 Pro 5.8 inch/11 Pro Max 6.5 inch